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Conference Keynotes 講演者
(1)Thin Film Metallurgy
村上 正紀（立命館大学）
(2)10 years of BEOL Wiring Innovations -
from Cu through Low-k to Airgaps
Dr. Daniel
Edelstein (IBM)
Conference 招待講演者
(1) STP Technology - Interconnects, CMOS,
MEMS, Packaging
佐藤昇男（NTT マイクロシステムインテグレーション研究所）
(2) Thermal Behavior of Advanced
Interconnect
Systems
Thomas Gessner
(Chemnitz University of Technology）
(3) Porous SiCOH BEOL dielectrics
for 45
and 32 nm CMOS Technologies
Stephen Gates
(IBM)
(4) Ru CMP For Bottom Electrode
Fromation
Jin-Goo-Park
(Hangyang Univ.)
(5) Electrofill Challenges and
Directions
for Future Device Generations
Jonathan
Reid (Novellus Systems)
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