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Advanced Metallization Conference 2006: 16th
Asian Session
Sep. 25-27, 2006,
Sanjo Conferene Hall, The Univ. of Tokyo,
Tokyo
Sep. 25: Tutorial
Sep. 26-27 : Conference
Sponsored by
ADMETA Committee,The Japan
Society of Applied Physics Silicon Technology
Division
In conjunction with
The Institute of Electrochemical Engineering
of Japan,The
Japan Institute of Metals, IEEE Japan
Council, IEEE EDS Japan
Chapter,The
Surface Finishing Society of JapanThe
Institute
of Electronics,
Information and Communication Engineers,The
Vacuum Society of Japan, The Surface Science Society of Japan,Japan
Society of Precision Engineering
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Dear Sir,
Advanced metallization Conference 2006: 16th
Asian Session, ADMETA 2006 will
be held in
September, 2006. The conference
started twenty
years ago. Since 1989,
the conference has been held both in Japan
and USA,
every year, in view of the remarkable technology
development in Asia. Current major scope of ADMETA is mainly
concerning with unit process and process
integration related to Cu and
Low-k, with production technology of the
current device, and with future interconnect
technology approaching the
potential limit. Aside from the
development on the technology nodes, we also
encourage the contributions of a
wide area from the material science to Packaging
technology. Paper submissions throughout Asia
are welcomed. We are looking forwards to
seeing you in Tokyo.
Akihiko Osaki (Renesas) [ADMETA2006 Chair]Takashi Yoda (Toshiba) [ADMETA2006 Program]
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