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Advanced Metallization Conference 2006: 16th Asian Session
Sep. 25-27, 2006,
Sanjo Conferene Hall, The Univ. of Tokyo, Tokyo

Sep. 25: Tutorial
Sep. 26-27 : Conference

Sponsored by
ADMETA Committee,
The Japan Society of Applied Physics Silicon Technology Division
In conjunction with

The Institute of Electrochemical Engineering of
Japan,The Japan Institute of Metals,   IEEE Japan Council,   IEEE EDS Japan Chapter,The Surface Finishing Society of JapanThe Institute of Electronics, Information and Communication Engineers,The Vacuum Society of Japan,   The Surface Science Society of Japan,Japan Society of Precision Engineering

Dear Sir,

Advanced metallization Conference 2006: 16th Asian Session, ADMETA 2006 will be held in September, 2006. The conference started twenty years ago.  Since 1989, the conference has been held both in Japan and USA, every year, in view of the remarkable technology development in Asia.  Current major scope of ADMETA is mainly concerning with unit process and process integration related to Cu and Low-k,  with production technology of the current device, and with future interconnect technology approaching the potential limit.  Aside from the development on the technology nodes, we also encourage the contributions of a wide area from the material science to Packaging technology.  Paper submissions throughout Asia are welcomed. We are looking forwards to seeing you in Tokyo.

Akihiko Osaki (Renesas) [ADMETA2006 Chair]Takashi Yoda (Toshiba) [ADMETA2006 Program]