Keynotes Speakers

M. Koyanagi （Tohoku University）, A New Smart-Stack Technology for Three-Dimensional LSI

Joaquin Torres, PhD　（ST Microelectronics）, Advanced BEOL R&D activity at Crolles Alliance

Invited Speakers

T. Hasegawa （Sony Corp.）, A 65nm/45nm-node interconnect technology featuring ULK stacked hybrid structure

Michael E. Mills （Dow Chemical Co.）, Advanced Electronic Materials for ULSI Metallization

Lynne M. Michaelson （Freescale Semiconductor, Inc.）, Electroless Deposition of Co-based Alloys for Selective Capping Applications

Changki Hong（Samsung Electronics Co., Ltd），Single Wafer Cleaning Process on Next Generation device

Sarah L. Lane （IBM Corp.）, BEOL Process Integration with Cu/SiCOH (k=2.8) Low-k Interconnects at 65 nm Groundrules

J. Koike （Tohoku University）, Self-Forming Barrier Process with Mn addition in Cu Metallization